Gerchamp Launches Modular AI Data Center to Bring High-Density Compute to Available Power

Hangzhou, Sept. 10, 2026 (GLOBE NEWSWIRE) -- Gerchamp, a provider of modular infrastructure for AI and high-density computing, today launched its modular AI data center portfolio, bringing factory-assembled power, liquid cooling, backup, and control infrastructure to sites with available power and limited space. The portfolio spans 500kW all-in-one systems to 3.5MW multi-container deployments, enabling AI compute to be deployed at the edge, on-premises, behind the meter, and in remote locations without relying on conventional data center construction.

AI Compute Is Moving Closer to the Workload
As AI workloads move closer to where data is generated and where power is available, infrastructure deployment is becoming a site-level challenge. Manufacturing facilities need real-time vision inference. Telecom operators are processing increasing volumes of local traffic and video. Oil, gas, and mining operations need to run AI on operational data in locations where connectivity and data center capacity may be limited.

In these environments, waiting years for a new data center is not always practical. AI infrastructure needs to work with the power, space, and site conditions already available.

A Modular Platform from 500kW to 3.5MW
Gerchamp's modular architecture is designed around this shift. Its vertically integrated platform combines power, direct-to-chip liquid cooling, UPS, Nickel-Zinc battery backup, BMS, DCIM, and power distribution into factory-assembled systems that can be delivered in months and powered in weeks.

The portfolio starts with a 500kW all-in-one system that integrates the infrastructure required to support AI compute in a single container. It provides IT space and power distribution for five OCP racks or four NVIDIA NVL72 racks, together with Gerchamp's proprietary direct-to-chip liquid cooling, UPS, Nickel-Zinc battery backup, BMS, and DCIM.

For larger deployments, Gerchamp combines multiple containers into a coordinated 3.5MW system. The configuration includes two IT containers, two cooling containers, and one power container, supporting 24 OCP racks or 20 NVIDIA NVL72 racks, with power density of up to 175kW per rack.

Factory-Integrated for Rapid Deployment
Each system is integrated and tested at the factory before shipment. Customer-selected servers and GPUs are installed separately, allowing 500kW of AI infrastructure to be brought online in weeks, while multi-megawatt deployments can be delivered in months.

The modular approach also allows capacity to grow with available power. Instead of building a large facility upfront, operators can deploy infrastructure in defined power blocks and expand as additional power and compute demand become available.

“AI infrastructure is no longer limited to traditional data center sites,” said Frank Yang, Chairman of Gerchamp. “Where power is available, there is an opportunity to deploy compute. The challenge is having infrastructure that can be deployed quickly and work within the site's constraints. We are bringing power, liquid cooling, backup, and intelligent controls together in a modular platform so AI infrastructure can go where compute and power come together.”

About Gerchamp
Gerchamp develops AI and high-density computing infrastructure spanning power, liquid cooling, backup power, battery management, and modular data centers. Its technologies include proprietary Nickel-Zinc battery systems, direct-to-chip liquid cooling, BMS, DCIM, and integrated power infrastructure for data centers, edge, on-premises, and other power-constrained computing environments. For more information, visit www.gerchamp.com.

Charlotte He
charlotte.he@gerchamp.com